Samsung appears to have failed in its quest to secure large customers for its 3nm GAA process, with TSMC having the upper hand as it reportedly aims to reach production of its next-generation node to 100,000 monthly wafers by the end of 2024. To combat its biggest foundry rival, instead of finding a way to increase its 3nm yields. Samsung is apparently focusing on its 2nm technology, and according to the latest report, the next Exynos SoC is supposedly being tested on this lithography.
The yield percentage for the 3nm GAA process has not exceeded 60 percent, and to actually make customers interested, Samsung needed to raise that figure to at least 70 percent, according to a previous estimation. Now, Sedaily reports that Samsung is making a giant leap towards the 2nm bandwagon, with discussions revolving around producing prototypes for Qualcomm and Samsung’s LSI division. This is the first time the company has been mentioned working on 2nm prototypes for its chipsets, suggesting that an unnamed Exynos could be in its early testing stages.
Previously, Samsung was said to be developing the Exynos 2500 with a 10-core CPU cluster, with the chipset directly succeeding the Exynos 2400, but it is unlikely that it will be mass producing using the 2nm process since this lithography is not expected to be utilized until 2026. Qualcomm was also previously reported to have requested 2nm samples from both Samsung and TSMC, but this technology will likely be leveraged for the Snapdragon 8 Gen 5 and not the upcoming Snapdragon 8 Gen 4.
In terms of progress, Samsung has already gained the upper hand against TSMC in the 2nm race by reportedly securing its first customer, a Japanese startup called Preferred Networks (PFN).
Read more on wccftech.com