The Tensor G4 will likely be powering the Pixel 9 and Pixel 9 Pro later this year, and while Google’s chipsets have historically delivered poorer performance and efficiency metrics compared to the competition, the upcoming chipset is rumored to receive a few upgrades. Going on the path of the Exynos 2400, a new report says that the Tensor G4 will be treated to FOWLP or ‘Fan out Wafer Level Packaging.’ While we have discussed the advantages of using this technology, let us inform readers who are hearing about it for the first time as its benefits might compel them to upgrade to the Pixel 9 or Pixel 9 Pro later this year.
The information from Korean media outlet FNN was spotted by tipster Revegnus, who provided a summary on X. Like the Exynos 2400, the Tensor G4 is said to be mass produced on Samsung’s 4nm process. However, the report did not mention which 4nm variation Google would adopt for the upcoming silicon, so we assume that it will be the 4LPP+ node. As for FOWLP, it is a welcome addition to help the Tensor G4 maintain its temperatures within the recommended threshold for more extended periods.
After witnessing Pixel 8 and Pixel 8 Pro thermal throttled when running the regular version of 3DMark’s Wild Life test and not the extreme version, it is evident that Google would have to make some extreme implementations to improve the successor. FOWLP technology employs more I/O connections for those who do not know, so electrical signals can pass through the chipset faster and more efficiently. This type of packaging also helps in heat resistance, allowing its SoC to maintain higher levels of multi-core performance since its temperature can be controlled.
Samsung states on its Exynos 2400 product
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