Samsung To Launch HBM3P Memory, Codenamed “Snowbolt” With Up To 5 TB/s Bandwith Per Stack
Samsung Electronics is set to reveal the next-generation high-bandwidth memory, HBM3P, which is codenamed "Snowbolt." Snowbolt will join the ranks of previous generations HBM & products from Samsung, such as Flarebolt, Aquabolt, Flashbolt, and Icebolt.
ZDNet Korea reports that Samsung filed a trademark application to the Patent Information Search Service (KIPRIS) for its latest DRAM, HBM3P Snowbolt, on April 26, 2023. It is expected to release in the second half of this year.
The documents reveal that the codename Snowbolt will coincide with the release of the high-bandwidth DRAM modules found in HPC cloud systems, supercomputers, and in use for artificial intelligence.
Snowbolt is the brand name of Samsung Electronics' next-generation HBM DRAM products, and it is still undecided whether the name will be used for which generation products.
— an official representative from Samsung Electronics
Previous generations from the Samsung Electronics HBM branch were:
During a recent conference call to investors and the media last month, a spokesperson for Samsung Electronics was quoted stating,
We have already supplied HBM2 and HBM2E products to major customers to provide the highest performance and highest capability products promptly that meet the needs and technology trends of the AI market, and HBM3 (16 GB and 12 GB). However, 24 GB products are also being sampled, and preparations for mass production have already been completed.
Not only the current HBM3 but also the next-generation HBM3P product with higher performance and capacity required by the market is being prepared for the second half of the year with the industry's best performance.
via Samsung
This will increase the overall performance for HBM3P by 10% over its
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