Qualcomm was previously rumored to be exploring a dual-sourcing option where it would enlist the help of TSMC’s and Samsung’s foundries to mass produce future chipsets, including the Snapdragon 8 Gen 4. Unfortunately, it appears that the San Diego has backtracked on its earlier intentions and may only stick with TSMC for another generation, this time utilizing the manufacturer’s N3E process.
Using different manufacturers can bring immense benefits, including significant cost savings for Qualcomm. No doubt, TSMC’s N3E process will be costly to the smartphone chipset maker, but according to a tweet from Revegnus, it will have little choice in the matter. The initial plan based on a previous tweet from the same person, hinted that not only will there be two versions of the Snapdragon 8 Gen 4, but they both will be mass produced on different foundries.
The Snapdragon 8 Gen 4 for Galaxy would have taken advantage of Samsung’s 3GAP process, which is also known as 3nm GAA+, while the regular version found in devices not made by the Korean giant’s facilities would be mass produced on TSMC’s N3E technology. Due to undisclosed reasons, Qualcomm may exclusively give TSMC orders in 2024, which can raise the wafer price substantially, with Qualcomm’s smartphone partners being forced to pay the balance. Revegnus has not shared the reason for this rumored change, but it may have something to do with its Samsung’s next-generation process.
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