Snapdragon 8 Gen 3, Dimensity 9300 Pre-Production Samples Rumored To See Improved Performance, But Cortex-X4 Issues Persist

wccftech.com:

Optimization work is still being done on the upcoming Snapdragon 8 Gen 3 and Dimensity 9300, with the latest rumor claiming that the samples have shown performance increases. However, there is still some room for improvement, with one tipster claiming that the issues will be ironed out during the mass production phase.

The exact performance numbers were not shared by Digital chatter, but he states that improvements are made. Since the Snapdragon 8 Gen 3 is reportedly launching after the Dimensity 9300, this gives Qualcomm some breathing room to make some tweaks before the flagship SoC is finally ready to perform in Android flagships. There were talks about the San Diego chip maker testing two versions of the Snapdragon 8 Gen 3, but according to updated rumors, the CPU cluster of the SoC is said to be ‘1 + 5 + 2,’ where it will only take advantage of a single Cortex-X4 core.

The only drawback of using a single Cortex-X4 core is that the Snapdragon 8 Gen 3 may not perform as well as the Dimensity 9300, which is rumored to rely on four high-performance cores, but according to an earlier rumor, it should have an edge in the efficiency category. According to the tipster, it appears that there are still some issues persisting with the Cortex-X4, which he states will be addressed during the mass production phase.

Based on past evidence, ARM’s fastest Cortex-X cores always had a glaring problem with overheating and eventual throttling, regardless if TSMC’s own manufacturing process had improved. This would be one of the reasons why Qualcomm is said to offer its custom Oryon cores starting with the Snapdragon 8 Gen 4 launch next year. Also, MediaTek may have its work cut out since the Dimensity 9300’s additional Cortex-X4 may cause