MediaTek is going all out with its flagship smartphone chipset release as the Taiwanese fabless semiconductor manufacturer will reportedly introduce its Dimensity 9400 in October. Like Qualcomm’s Snapdragon 8 Gen 4, the upcoming SoC is said to be mass produced on TSMC’s second-generation 3nm process, bringing in a wave of performance and efficiency improvements. MediaTek’s CEO, Rick Tsai, has expressed confidence in the upcoming silicon and believes that the Dimensity 9400’s release will allow the company to experience a 50 percent increase in annual revenue.
As reported by Commercial Times, during MediaTek’s earnings call on July 31, Tsai noted that the company anticipates a return to regular seasonal patterns in H2 2024, with the fourth quarter largely depending on consumer product demand. Seeing as how the Dimensity 9300 helped MediaTek post a 70 percent revenue growth in 2023, with the chipset alone bringing in $1 billion, the company’s Chief Executive could be under the impression that the Dimensity 9400 will deliver the same success as it is a significantly more advanced SoC.
Like the Dimensity 9300, the Dimensity 9400 is rumored to lack power-efficient cores, relying solely on performance cores to deliver unrivaled single-core and multi-core performance by taking advantage of ARM’s ‘BlackHawk’ CPU architecture. It is also reported that MediaTek’s flagship silicon will feature the largest die ever, measuring 150mm² and boasting 30 billion transistors, resulting in an enormous cache and upgraded Neural Processing Unit. These upgrades should give the Dimensity 9400 improvements in on-device generative AI capabilities, though we must see how
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