Samsung Receives Huge Order of HBM3 Memory To Power AMD MI300X GPUs

wccftech.com:

AMD has reportedly settled a deal with Samsung to utilize its cutting-edge HBM3 memory and the respective packaging technology for MI300X GPUs.

Samsung has become a center of attraction in the industry, mainly for several reasons. The primary one is that TSMC holds most of its share in the chiplet packaging market, but it is heavily occupied by NVIDIA's huge AI GPU orders, which has put companies like AMD on the back foot. Since AMD plans to adopt an aggressive approach in the AI industry, it needs a reliable and consistent partner such as Samsung.

It is reported that Samsung has passed decisive quality tests for its next-gen HBM3 memory and is positioned to bring AMD on board. We previously reported that the company has also proposed a "hybrid" approach to NVIDIA, taking responsibility for all manufacturing processes, such as wafer acquisition to 2.5D packaging. This is why Samsung has attracted immense interest in the MI300X GPUs, and the company is expected to gain a 50% share in the HBM market next year.

The Samsung HBM3 memory and packaging technology will be harnessed by the MI300X GPUs and other Instinct MI300 accelerators which will lead the charge of AMD's AI growth in the coming year.

Apart from AMD, NVIDIA is also eying Samsung as a potential supplier, since TSMC is currently unable to fulfill the immense demand from the AI industry. It is said that Team Green is facing huge order backlogs, extending delivery times by six months. With disruptions in supply chains come compromised profits, due to which NVIDIA aims at maximizing its production. Hence we could see a "dual-source" strategy by the company. However, bringing Samsung on board could tarnish the NVIDIA-TSMC relationship, a cost that NVIDIA can't afford.