MediaTek, the Taiwanese fabless chipmaker, has introduced its latest chipset, the Dimensity 8400, targeting the premium smartphone segment. This new release follows the Dimensity 8300 SoC from last year and is designed to deliver enhanced Gen AI performance. The Dimensity 8400 builds on the foundation of the flagship Dimensity 9400, bringing cutting-edge features aimed at elevating the user experience. The first smartphones powered by this chipset are expected to hit the market by the end of 2024.
The Dimensity 8400 is the first premium smartphone chipset to feature an All-Big Core CPU design. This configuration, paired with a high-performance NPU, significantly boosts the chipset's ability to accelerate Gen AI tasks. Additionally, MediaTek has introduced the Dimensity Agentic AI Engine (DAE), a tool that transforms conventional AI applications into more dynamic, agentic AI experiences.
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The chipset includes an eight-core Arm Cortex-A725 processor clocked at up to 3.25GHz, offering a 41% improvement in multi-core performance over its predecessor, the Dimensity 8300. It also boasts a 44% reduction in peak power consumption, enhancing energy efficiency.
For gamers, the Dimensity 8400 is equipped with the Arm Mali-G720 GPU, which delivers a 24% improvement in peak performance and a 42% increase in power efficiency compared to the Dimensity 8300. It works alongside MediaTek's Frame Rate Converter (MFRC) and Adaptive Gaming Technology (MAGT) 3.0 to provide smoother, more optimised gaming experiences in real-time.
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On the Gen AI front, the Dimensity 8400 leverages MediaTek's NPU 880, which supports global LLM/SLM/LMM applications. This feature enables users to engage with the latest-gen AI functions, such as translation, rewriting, contextual responses, AI recording, and media generation. The DAE also
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