Intel is all set to initiate production for its 20A (2nm process) next year, as revealed in an interview (via Nikkei) by the company's Senior Vice President.
The competition in the semiconductor industry is heating up with the likes of TSMC and Samsung Foundry, announcing their plans to commence 2-nanometer production somewhere in 2024. However, Intel Foundry has reportedly joined the bandwagon, as the firm reveals plans for cutting-edge semiconductor production. Intel's Senior VP, Sanjay Natarajan, has disclosed the fact that the company will "lead the way in miniaturization" through its 20A process, which will see production next year.
Let's take a quick recap on Intel's 20A node, which is expected to revolutionize both the portfolio of IFS and the semiconductor industry. The 20A node is expected to feature brand new RibbonFET transistors that will replace the existing FinFET architecture and deliver new interconnect innovations, one known as PowerVia. Arrow Lake will be among the biggest product family that makes use of the 20A process node and we can also expect a few 3rd party clients leveraging this node through IFS.
The company expects to achieve manufacturing readiness for 20A within the first half of 2024 as planned with Arrow Lake being the lead product which is expected to launch in the second half of 2024. During SemiCon Japan, Intel Vice President John Guzek, also confirmed that the development line of the Glass Substrate technology for next-gen chips will become operational in 2025 so we can expect chips utilizing the new solution in the second half of this decade.
Intel Foundry, particularly with its semiconductor, hasn't seen much success in terms of industry adoption in recent times however, things look to
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