Intel Lunar Lake CPU Mass Production Commences At TSMC Using N3B Node, First Laptops Heading For Q3 Launch
Intel's Lunar Lake CPUs have entered the mass production stage at TSMC using their N3B node and the first laptops are expected in Q3 2024.
Intel's Lunar Lake "Core Ultra 200V" CPUs Enter Mass Production At TSMC Using The Advanced N3B Process Node
Intel's Lunar Lake CPUs are going to be Blue Team's most advanced SOC to date, featuring lots of tiles on a single package along with on-package memory solutions in the form of LPDDR5x. These chips have now entered mass production at TSMC and will be utilizing the N3B process, making it the first Intel CPU to be entirely produced at TSMC.
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According to a report from DigiTimes, Intel has taken up the vast majority of orders of the TSMC 3nm process node, giving them the lead over competitors such as AMD, NVIDIA, and Qualcomm. Not only Lunar Lake "Core Ultra 200V" but the Arrow Lake "Core Ultra 200" CPUs will also utilize TSMC's process technologies with the company anticipated to replace its own Intel 20A node for TSMC's N3B node for certain tiles on Arrow Lake. The iGPU tile for Arrow Lake and Lunar Lake is also going to leverage TSMC process nodes.
Intel's Arrow Lake and Lunar Lake CPUs are going to be very similar in terms of their compute tile which makes use of Lion Cove P-Cores and Skymont E-Cores. The main differences stem from the iGPU and I/O/SOC tiles which make use of different cores and technologies such as Alchemist & Alchemist+ Xe/Xe+ architectures for Arrow Lake CPUs and Xe2 GPUs for Lunar Lake chips.
Intel's Lunar Lake CPUs are expected to launch with the first laptops shipping in Q3 2024. These laptops will be Intel's first Microsoft Copilot+ compliant devices however the Copilot+ features are going to be enabled through an update soon after launch and won't ship with the laptops like is the case with Qualcomm's Snapdragon X platform. Intel's Arrow
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