Intel's capital investment spree is showing no signs of slowing down. The company has announced its latest plans including a 30 billion euro plan to bring cutting-edge chipmaking capacity to Germany. News of the German plan comes after Israeli Prime Minister Benjamin Netanyahu announced a $15 billion expansion of operations. That's on top of $10 billion already announced, but delayed due to the Covid-19 pandemic.
Netanyahu, along with German Chancellor Olaf Scholz have hailed their respective deals as the largest foreign investments in the history of both countries. Both facilities will create high tech hubs, boosting employment and downstream technology industries. That's in addition to the broader strategic goals of lowering dependence on Asian based chipmakers, such as TSMC.
The German deal comes after Intel sought greater support from the German government. It seems to have gotten what it wanted, as the government has agreed to nearly 10 billion euros worth of incentives and subsidies (according to Reuters). Intel says the deal involves «increased government support that includes incentives, reflecting the expanded scope and change in economic conditions since the site was first announced.»
The German fabs are set to be built in Magdeburg, Saxony-Anhalt. Intel says it will equip the facilities with leading edge Angstrom era manufacturing capabilities. It says the facilities «Will create a first-of-its-kind, leading-edge end-to-end semiconductor manufacturing value chain in Europe, serving European customers and helping to fulfill the EU’s ambitions for a more resilient semiconductor supply chain.»
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