Huawei Rumored To Adopt A Unified Architecture For Its Upcoming Kirin PC Chips, Similar To Apple’s M-Series; SoC, DRAM Are Integrated Into A Single Package
Apple introduced a unified memory architecture in 2020 when it unveiled the M1, its first custom chipset that powered a variety of Macs, and since then, the technology has not inched away from this approach. Huawei, likely realizing this architecture’s benefits, is rumored to adopt it in its Kirin PC chip, thereby integrating the SoC and DRAM onto a single package. As for what advantages this change brings to the table, we have discussed below, so read on more to find out.
By incorporating all core components on a single package, Huawei’s Kirin PC chip will have a higher memory bandwidth, lowered latency, and other benefits
A traditional CPU package will have various components soldered on different areas of the motherboard. With a unified memory architecture, the SoC and DRAM are present on a single die, allowing both parts to communicate with each other significantly faster. The further the DRAM chips are away from the CPU and GPU, the longer it takes for data to be copied between different memory locations, a process that also increases power consumption. With the rumor posted by @jasonwill101 on X, Huawei will eliminate this bottleneck by introducing its first Kirin PC chip.
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Another advantage of adopting a unified memory architecture is that this system offers high bandwidth to the chipset as the DRAM is much closer to the SoC. This will allow the CPU, GPU, and Neural Processing Unit to access vast amounts of data pools in seconds. This approach also means that machines featuring these chips may never run out of memory during tasks requiring the CPU and GPU to run in unison. Unfortunately, the biggest drawback is that the DRAM chips are baked onto the package, so there is no way of physically upgrading them.
The rumor does not mention how many memory tiers Huawei will offer with the launch of its
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