AMD To Utilize Samsung 4nm & TSMC 3nm Nodes For Next-Gen Chips, Zen 5C Possibly Codenamed Prometheus

wccftech.com:

AMD is expected to utilize Samsung's 4nm and TSMC's 3nm process node for its next-generation chips as hinted in a new leak along with a brand new Prometheus codename.

The latest information comes from gamma0burst who have compiled a huge list of data based on Employee profiles/projects on LinkedIn. According to the data, one engineer has listed a range of process nodes that are being leveraged by AMD for the development of its next-gen IPs. The most interesting ones include TSMC N3 (3nm) and Samsung 4nm. We know that AMD is going to use a mix of 4nm and 3nm process nodes for its Zen 5 core architecture but the company has so far relied on TSMC for production.

It was previously reported that AMD might shift some production to Samsung and utilize its 4nm process technology though the extent of this deal is unknown. It is likely that AMD might've used Samsung Foundries for a test run or a certain I/O die but current reports indicate that it is unlikely that AMD would produce any major IP on Samsung 4nm. We can't say for sure until or unless the word comes directly from AMD.

Besides that, the leak also mentions a brand new codename, Prometheus. A previous leak had revealed that the Zen 4 codename is Persephone, Zen 5 is Nirvana, and Zen 6 is Morpheus. It is known that the Zen 4C core is codenamed Dionysus so the likelihood of Prometheus being the codename of the Zen 5C core is high.

The AMD Zen 5 and Zen 5C core architectures will be a major deal in 2024-2025. They are going to power a range of families including Strix Point (Ryzen Laptops), Granite Ridge (Ryzen Desktop), and Turin (EPYC Server). There are going to be many more products and we are expected to see a slight glimpse of those during the coming months at major events