AMD has confirmed that they are working on Hybrid CPUs and will also keep pushing core counts forward with next-gen designs.
In an interview with Tomshardware, AMD's CTO, Mark Papermaster, spilled the beans on some of its plans for the future which involve hybrid chip designs, increased core counts, and reliance on AI for chip design and manufacturing.
Mark points out that we are getting to the point where one chip doesn't fit all needs & that's more prevalent in the server segment which is why the company is offering a diverse range of solutions in its Zen 4 EPYC lineup, ranging from the classic Zen 4 Genoa to 3D V-Cache Genoa-X, Bergamo in Zen 4C flavors and Siena for TCO & Power-Optimized platforms. Recent rumors have highlighted a more diverse range of EPYC products in the upcoming Zen 5 and Zen 5C lineup.
According to AMD, we'll not just see variations in core densities for example Zen 4 & Zen 4C, but also variations in the types of cores themselves. This is a similar approach that Intel & Apple take when designing their current generation of CPUs, mixing high-performance cores with low-power cores that are optimized for max efficiency. The hybrid approach would also allow AMD to stack multiple 3D layers that include either cache or use various accelerators that are workload-specific optimized.
AMD also reaffirms that the technology to enable higher core counts will continue moving forward but that isn't the only path that would evolve in future chips. Increasing the core counts could be an important aspect to one customer but the other customer may require the same exact core counts but some added acceleration as mentioned above. Mark goes on to confirm that the current Ryzen 7040 CPUs are a taste of this hybrid
Read more on wccftech.com