TSMC Gears Up To Launch New, Advanced 2-nanometer Chip Technology
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According to a new report from Taiwan, the Taiwan Semiconductor Manufacturing Company (TSMC) will commence mass production of its 2-nanometer semiconductor process in 2025. The timeline matches TSMC's schedule, which its management has provided several times during analyst conferences. Additionally, these rumors suggest that TSMC is also planning a new 2-nanometer node called N2P which will enter production in the year after N2. TSMC is yet to confirm a new process called the N2P, but it has used similar naming for its current 3-nanometer semiconductor technologies, with N3P being an enhanced version of N3 and reflecting refinements in the production process.
Today's report comes from Taiwanese supply chain sources and shares that TSMC's 2-nanometer semiconductor mass production is on schedule. The company's executives have outlined the timeline for the next-generation manufacturing process several times, including during a conference in 2021 where the firm's chief executive Dr. C.C. Wei shared that his firm is confident about 2-nanometer mass production in 2025.
Since then, the TSMC's senior vice president for research and development and technology, Dr. Y.J. Mii, confirmed this timeline last year, and Dr. Wei's latest take on the matter came in January when he revealed that the process was 'ahead of schedule' and will enter the test production stage in 2024 (also part of TSMC's timeline).
The latest rumors build on these statements and add that mass production will occur at TSMC's facilities in Baoshan, Hsinchu. The Hsinchu plant is TSMC's first choice for the advanced technology,
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