The Snapdragon 8 Gen 4 will be Qualcomm’s first smartphone SoC to shift away from the traditional CPU designs, with the company now switching to custom Oryon cores to take the fight directly to Apple. The San Diego firm is now rumored to adopt the same CPU cluster as MediaTek’s Dimensity 9300, meaning that we might no longer see low-power cores present on the upcoming silicon.
It has been known for a while that both the Snapdragon 8 Gen 4 and Dimensity 9400 will be mass produced on TSMC’s 3nm process and, more specifically, the Taiwanese manufacturer’s ‘N3E’ process. However, the tipster Digital Chat Station takes it one step further by sharing more details, starting with the codename of next year’s flagship silicon, which is ‘Sun.’ He also shares that the CPU cluster will be in a ‘2 + 6’ configuration, with two high-performance Phoenix cores followed by six mid-tier cores with the same name.
The absence of efficiency cores can mean that the power consumption of the Snapdragon 8 Gen 4 will see a major spike compared to the Snapdragon 8 Gen 3, but TSMC’s 3nm process should help in this matter. Regardless, with just a performance cores configuration, the Snapdragon 8 Gen 4 can obtain an impressive multi-core result, with early tests revealing that the SoC’s Adreno 830 GPU is faster than the Apple M2’s graphics processor.
All of this information suggests that the Snapdragon 8 Gen 4 will be worth the wait, but Qualcomm’s partners may not think that especially when the silicon is said to be more expensive than the Snapdragon 8 Gen 3 as a result of switching to those custom Oryon cores. Regardless, 2024 will be exciting, and we will continue to share updates with our readers, so stay tuned.
News Source: Digital Chat Station
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