MediaTek CEO Says That Company Is Working Very Closely With TSMC For The Next 3nm Chipset, Hinting At Dimensity 9400’s Speedy Development

wccftech.com:

MediaTek previously announced that it has successfully developed the 3nm SoC with TSMC, making it 32 percent more power-efficient than previous-generation silicon, though the exact name of the chipset was not mentioned. Now, the Taiwanese company’s CEO has spoken about the close partnership with its foundry partner, stating that both entities are working together to launch its first 3nm product, which is rumored to be called the Dimensity 9400.

Comparing 2024 with 2023, MediaTek CEO Rick Tsai says in the latest report from Economic News Daily that next year will be significantly better thanks to the AI boom, and with the company offering its own chips focused on this category, it should result in a positive outcome. Earlier, analysts pointed out that the Dimensity 9300 is currently the most powerful smartphone chipset, and with Android phone makers using it in their flagships, it will result in an increased number of orders, resulting in MediaTek’s global market share reaching 35 percent, threatening Qualcomm’s dominance.

The Chief Executive also mentioned that its partnership with TSMC allows MediaTek to focus deeply on the new 3nm chipset and says it has teamed up with Intel for the latter’s 16nm node too, though it is not reported which silicon would launch on that manufacturing process. For those that do not know, the Dimensity 9400 is rumored to be MediaTek’s first 3nm SoC, with the company apparently taking advantage of TSMC’s ‘N3E’ process with improved yields than the N3B variant that Apple uses for the A17 Pro and M3.

A strong business relationship between the two companies can also allow the Dimensity 9400 to be optimized for various smartphone partners. The Dimensity 9300 exudes incredible performance but at the