Samsung To Supply High-Performance Substrates To AMD For Next-Gen Data Center CPUs & GPUs
Samsung has announced its partnership with AMD and will be supplying high-performance substrates for next-gen CPUs & GPUs for Data Centers.
Samsung Wins AMD Deal To Supply High-Performance Substrates For Next-Gen Data Center CPUs & GPUs, Ensuring High Yields
Press Release: Samsung Electro-Mechanics (SEMCO) today announced a collaboration with AMD to supply high-performance substrates for hyperscale data center compute applications.
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Market research firm Prismark predicts that the semiconductor substrate market will grow at an average annual rate of about 7%, increasing from 15.2 trillion KRW in 2024 to 20 trillion KRW in 2028. SEMCO's substantial investment of 1.9 trillion KRW in the FCBGA factory underscores its commitment to advancing substrate technology and manufacturing capabilities to meet the highest industry standards and future technology needs.
SEMCO's collaboration with AMD focuses on meeting the unique challenges of integrating multiple semiconductor chips (Chiplets) on a single large substrate. These high-performance substrates, essential for CPU/GPU applications, offer significantly larger surface areas and higher layer counts, providing the dense interconnections required for today's advanced data centers. Compared to standard computer substrates, data center substrates are ten times larger and feature three times more layers, ensuring efficient power delivery and lossless signal integrity between chips. Addressing these challenges, SEMCO's innovative manufacturing processes mitigate issues like warpage to ensure high yields during chip mounting.
SEMCO's FCBGA factory is equipped with advanced real-time data collection and modeling capabilities, enabling SEMCO to develop predictive manufacturing models that ensure signal, power, and mechanical integrity. This state-of-the-art facility positions SEMCO as a leader in the production of embedded substrates
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