Micron has unveiled its DDR5 MRDIMM modules, which are targeted at the rapidly growing AI and HPC markets with up to 8800 MT/s speeds.
Micron's multiplexed-rank DIMM memory is the firm's latest product. It is supposedly designed for the next generation of Intel's Xeon CPUs, specifically the 6th generation Granite Rapids family. Intel confirmed earlier this year that its latest Granite Rapids chips can support up to DDR5-8800 MT/s memory modules.
The MRDIMM memory is specifically designed for data center environments and targets higher bandwidth and lower latency, properties demanded by the AI markets. Regarding how the MDRIMM technology works, it utilizes existing foundations of DDR5, but it combines multiple ranks of memory modules into a single DIMM, allowing for higher data transfer rates.
According to Micron, the DDR5 MRDIMM standard is expected to debut in five different capacities, which include 32 GB, 64 GB, 96 GB, 128 GB, and 256 GB. In terms of speeds, the DDR5 MRDIMM modules are expected to operate at a speed of 8800 MT/s, which is quite high for HPC applications, but that is the purpose of the new MRDIMM memory type. Micron says with such high bandwidth onboard, next-gen server CPUs will receive a significant boost in performance, ultimately making next-gen AI servers much more capable.
In terms of performance gains, Micron says that with the new MRDIMM technology, which employs multiple ranks of memory modules, the firm has managed to increase memory bandwidth by up to 39% compared to the traditional RDIMM technology. Apart from that, MRDIMM brings 15% more bus efficiency and 40% lesser latency, which means that the technology is slated for mass adoption amongst the AI and HPC markets.
Interestingly, Micron's DDR5
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