Intel Scales Up Outsourcing Efforts, 3nm Handed Over To TSMC & Adds In New Suppliers For Advanced Packaging
Intel looks to ramp up outsourcing efforts as the firm chooses TSMC for its mainstream semiconductor needs while adding new Taiwan suppliers as well.
Intel Becomes More Reliant On Taiwan Suppliers As The Firm Apparently Shifts Away From Its Own Division Services
Well, it looks like Team Blue has decided to take market competition seriously. That's why they have decided not to trust IFS for now and rather move towards "well-established" alternatives in the markets. Previously, we reported on how Intel's next-gen Falcon Shores AI accelerators will be handed over to TSMC for development, particularly utilizing the 3nm process, showing that Intel has indeed increased its reliance on the Taiwan giant. Not to mention the development of the Arrow Lake compute tile on TSMC's 3nm process, which is indeed a massive change.
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After semiconductors, Taiwan Economic Daily reports that Intel has approached Taiwanese suppliers such as Egis Technology and Alchip, which specializes in IP design, along with KYEC, in order to expand its outsourcing efforts into other parts of the supply chain, notably advanced packaging. Given that Egis is already engaged with Intel in collaborating on the 2.5D packaging technology, it seems like Intel is eager to move one step ahead, utilizing its partner's packaging IP into its mainstream products.
This move shows that Intel is proceeding toward something much bigger, probably an end-long one, which will allow them to remain relevant in the market for a larger period of time. It looks like Team Blue has realized that being dependent on its divisions isn't sustainable for the future, and this brings massive roadblocks in the form of higher utilization of financial resources, which gives competitors an edge since by outsourcing processes, a large part of the development process gets handed over to third-party partners.
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