AMD Instinct MI300X & MI300A AI Accelerators Detailed: CDNA 3 & Zen 4 Come Together In An Advanced Packaging Marvel
The AMD Instinct MI300X & MI300A are some of the most anticipated accelerators in the AI segment which will launch next month. There's a lot of anticipation surrounding AMD's first full-fledged AI masterpiece and today we thought about giving you a roundup of what to expect from this technical marvel.
On the 6th of December, AMD will host its "Advancing AI" keynote where one of the main agendas is to do a full unveiling of the next-gen Instinct accelerator family codenamed MI300. This new GPU and CPU accelerated family will be the lead product of the AI segment which is AMD's No.1 and the most important strategic priority right now as it finally rolls out a product that is not only advanced but also is designed to meet the critical AI requirement within the industry. The MI300 class of AI accelerators will be another chiplet powerhouse, making use of advanced packaging technologies from TSMC so let's see what's under the hood of these AI monsters.
The AMD Instinct MI300X is definitely the chip that will be highlighted the most since it is clearly targeted at NVIDIA's Hopper and Intel's Gaudi accelerators within the AI segment. This chip has been designed solely on the CDNA 3 architecture and there is a lot of stuff going on. The chip is going to host a mix of 5nm and 6nm IPs, all combining to deliver up to 153 Billion transistors (MI300X).
Starting with the design, the main interposer is laid out with a passive die which houses the interconnect layer using a next-gen Infinity Fabric solution. The interposer includes a total of 28 dies which include eight HBM3 packages, 16 dummy dies between the HBM packages, & four active dies and each of these active dies gets two compute dies.
Each GCD based on the CDNA 3 GPU architecture
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