TSMC Roadmap Details 3nm & 2nm Process Technologies: N3E, N3P, N3X, N2P, N2X
Taiwan Semiconductor Co. (TSMC) showcased its newest process technology advancements which include 3nm and 2nm nodes.
During the talks, the company divulged its progress in 2nm process technology and new partners for the company's current 3nm technology, which will offer a more extensive range of process technologies that will be able to meet broader audience demand. Included in the technological advances are N3P, N3X, and N3AE. Additionally, the company discussed its 2nm goals and 3DFabric progression.
The new process technologies from TSMC will offer more for HPC and automotive applications while offering more power and performance.
The North America Technology Symposium supplies over 1,600 customers and partners registered to attend. It is the first of the TSMC's Technology Symposiums worldwide that are rolling out over the next several months. The North American symposium also showcases an Innovation Zone spotlighting eighteen emerging start-ups' compelling technologies.
Our customers never stop finding new ways to harness the power of silicon to create innovations that shall amaze the world for a better future. In the same spirit, TSMC never stands still, and we keep enhancing and advancing our process technologies with more performance, power efficiency, and functionality so their pipeline of innovation can continue flowing for many years to come.
— Dr. C.C. Wei, TSMC CEO
Key technologies highlighted at the North America Technology Symposium include:
Broader 3nm Portfolio, including N3P, N3X, and N3AE – Now that 3nm technology is in volume production and the N3 process and N3E version are on the way during 2023, the company is adding new variations to its roadmap to meet the diverse demands of its clients.
2nm Technology
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