NVIDIA has placed additional wafer supply orders at TSMC due to the growing demand for its top AI GPUs such as the A100 & H100.
In a previous report, we mentioned how the demand for HPC and AI GPUs from NVIDIA can disrupt the supply of gaming chips as the company wants to allocate more resources towards AI which it's calling a revolution for the PC and tech industry. It was expected that the demand would sooner or later outstrip the supply but NVIDIA is working round the clock to make sure that it can still offer a decent supply of chips to its biggest partners who are willing to pay the extra price of securing the top AI chips in the world. NVIDIA has also been the major driving force behind ChatGPT & several thousands of its GPUs are powering the current and latest models.
Now, DigiTimes has reported that NVIDIA is placing additional orders at TSMC for chips that utilize the CoWoS packaging technology, CoWoS which is otherwise known as Chip-on-Wafer-on-Substrate is a packaging technology that is deployed within NVIDIA's top data center and cloud GPUs that use HBM memory. Currently, NVIDIA's Ampere line of A100 & Hopper line of H100 and their derivatives are utilizing this technology and they also happen to be the same chips that are being used for AI & machine learning applications.
Nvidia has recently obtained TSMC's commitment to CoWoS support for an additional 10,000 wafers in 2023, the sources said, adding TSMC may have to give Nvidia extra CoWoS support for 1,000 to 2,000 wafers monthly throughout the rest of the year.
TMSC has a monthly CoWoS capacity of 8,000 to 9,000 wafers, and extra demand from Nvidia means the foundry's CoWoS supply will become tight, the sources said.
Nvidia is optimistic about demand for AI
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