AMD CEO Says Moore’s Law is Not Dead: Working On 3nm Now, Looking Beyond 2nm & Will Continue Using Chiplets

wccftech.com:

AMD CEO, Dr. Lisa Su, states that Moore's Law is not dead and that innovations such as chiplets & 3D packaging will help overcome the challenges.

In an interview with Barron's, AMD CEO, Dr. Lisa Su, points out that Moore's Law is not dead but has slowed down and things need to be done differently to overcome the performance, efficiency, and cost challenges. AMD has been the pioneer of advancing 3D packaging and chiplet technology with its first HBM designs back in 2015, chiplet processors in 2017, and also the first 3D packaging on a chip with its 3D V-Cache design in 2022.

Moore's Law was proposed by the co-founder of Intel, Gordon Moore, back in 1965 (~1975) and said that the number of transistors would double every year. Gordon Moore passed away on the 24th of March but his legacy still lives in the tech world with Intel and AMD still standing by his law. Meanwhile, NVIDIA thinks that Moore's Law has run out of gas and no longer applies to its business strategy.

AMD's CEO states that chiplets and 3D Packaging are the solutions that their company has invested in, today, and there's a lot more on the way. The chipmaker will be launching its MI300, a true exa-scale APU that combines various CPU, GPU, and Memory IPs in several chiplets and 3D dies on one singular package. It's a gargantuan chip and will be leading AMD's charge into the AI segment later this year.

I would certainly say I don’t think Moore’s Law is dead. I think Moore’s Law has slowed down. We have to do different things to continue to get that performance and that energy efficiency.

We’ve done chiplets—that’s been one big step. We’ve now done 3-D packaging. We think there are a number of other innovations, as well.

Software and algorithms are also quite