Snapdragon 8 Gen 4, Dimensity 9400 Rumored To Be Mass Produced On TSMC’s 3nm Process For 2024, Claims Tipster

wccftech.com:

Qualcomm and MediaTek might be a generation behind Apple when using TSMC’s cutting-edge technology for mobile chipsets, but next year, both companies are rumored to close the gap when they officially announce the Snapdragon 8 Gen 4 and Dimensity 9400. One tipster claims that both SoCs will use TSMC’s 3nm process, and as usual, he leaves out some of the more important details.

Before talking about next year’s Snapdragon 8 Gen 4 and Dimensity 9400, tipster Digital Chat Station talks about the newly announced chipsets, the Snapdragon 8 Gen 3 and the ‘soon to be unveiled’ Dimensity 9300. This year, Qualcomm and MediaTek relied on TSMC’s N4P process rather than going down the Apple route and using the 3nm ‘N3B’ node due to the costly wafers, but TSMC’s N3E technology is said to produce better yields while also being priced appropriately.

MediaTek already announced its partnership with TSMC earlier this year, stating that volume production of the unnamed silicon will start in 2024 and that the new manufacturing process can deliver up to an 18 percent performance increase and 32 percent power savings over the previous-generation N5. While Qualcomm has yet to announce anything officially, it is expected that the new Snapdragon 8 Gen 4 will take advantage of the same fabrication process as the Dimensity 9400.

The tipster has noted that the Snapdragon 8 Gen 4 will use Qualcomm’s custom Oryon cores, but when referring to the Dimensity 9400, he claims that MediaTek’s SoC is somewhat constrained but does not expand upon his post. It could mean that the chipset does not display a sufficient performance gain for its power consumption, but it is too early to make these claims when the Dimensity 9300 is yet to be announced.

However, one