NVIDIA CEO Says Blackwell “Design Flaws” Were 100% On The Company, TSMC Had No Part To Play & Now Back To Full Production
NVIDIA says that Blackwell's design flaws are 100% on them, saying that TSMC had no part to play and that the Taiwan giant sorted the issue out.
NVIDIA Verifies That The Firm Indeed Witnessed Blackwell Design Flaws; However, The Issue Was Rectified At An "Incredible Pace"
Team Green's Blackwell AI portfolio is one of the most in-demand products in the industry, mainly due to the performance and capabilities it brings onboard. However, a few weeks prior to launch, it was rumored that the architecture had become a victim of design flaws, with the culprit being the packaging technology onboard, and the problem was associated with TSMC's CoWoS, creating the perception that the Taiwan giant was behind NVIDIA's Blackwell flaws.
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However, in a report by Reuters, NVIDIA's CEO Jensen Huang has verified that Blackwell was indeed encountered with design flaws, but interestingly, TSMC had no part to play in it, and instead, it was "100% NVIDIA's fault". Here is what he had to say:
Well, it looks like NVIDIA has resorted to fixing Blackwell production, and interestingly, the blame is off TSMC's shoulders, given that Jensen himself has cleared the Taiwan giant off the list. The firm has sampled multiple chips to make a Blackwell product work out, which shows that the company was indeed faced with troubled yield rates, which would've been much more devastating for NVIDIA's business, but fortunate enough, Blackwell has been rescued.
Given that initial Blackwell products are now in the shipping phase, moving into Q4 2024, it will be interesting to see how the architecture turns out for the industry. NVIDIA has said that Blackwell is slated to be the most "successful" product in the company's history. The next phase of NVIDIA's AI hype will surely be interesting, potentially surpassing the hype created by the Hopper generation.
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