Next-Gen Intel Chips Will Feature More Sand As Glass Is Set To Replace Organic Substrate Materials

wccftech.com:

Intel has showcased its next-gen Glass Substrate packaging technology which will replace existing organic materials & offer higher interconnects.

The technology showcased by Intel is "glass substrates", which replace the conventional organic packaging that is currently being used on existing chips. Before going into the depths of how the technology works, Intel has claimed that "glass substrates" are the way to go in the future, & the packaging technology could rapidly allow large-scale innovations within industries, especially HPC and AI since chip packaging has been the talk of the town recently.

After a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come.

-Babak Sabi, Intel Senior VP

The critical element that makes a particular chip packaging technology superior is its ability to integrate as many "chiplets" in a single package. With glass substrates, Intel discloses that manufacturers can now feature "larger chiplet complexes", which gives the ability to reduce the footprint of a single package, leading to a much more efficient and enhanced performance bump.

Glass substrates now come with a more considerable temperature tolerance and a flatter design, contributing to interlayer connectivity. Intel states that glass substrates have a phenomenal 10x increase in interconnect density, leading to seamless power delivery.

In the pictures above, you can see that the bordering segments of the demo chip above have a glass-like finish. Usually, this area of any modern chip will be composed of organic materials and that's how current chips are made. But