Intel LGA-1851 Socket Adopts New “RL-ILM” Loading Mechanism, Better Thermals & Cooler Compatibility Detailed

wccftech.com:

Intel's LGA-1851 socket will be getting a new "optional" ILM configuration for better thermal performance without requiring a contact frame.

Intel LGA 1851 Socket Detailed, Comes In Two Configurations With Default & Reduced-Load ILMs, Coolers Forward Compatible With Socket, & Some Small Changes In Dimensions

When we talk about Intel's history with CPU sockets, the firm is known to make frequent changes within each generation. Similarly, the upcoming LGA-1851 will feature plenty of changes, and the pin layout, as we already discussed earlier, has shown that the upcoming socket is completely different from the previous LGA 1700.

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Now, hardware leaker Jaykihn reports that LGA-1851 will debut with two different loading mechanisms, with one being the traditional ILM solution which will be compatible with existing coolers, and the other being RL-ILM (Reduced Load ILM) which has been designed specifically to offer enhanced thermal performance but with different compatibility requirements.

For those unaware, by loading mechanisms, we mean a metal structure that surrounds the socket and provides the mechanism for securing the CPU, seating it onto the motherboard. Up till now, Intel's CPUs debuted with a single mechanism called the ILM (Independent Loading Mechanism), but the ILMs were known to be disadvantageous for overclockers since the mechanism reduced the contact area of the processor with the cooling solution, ultimately causing troubles in heat dissipation.

Several contact and direct-die frames were implemented for previous 12th/13th/14th Gen CPUs to enhance the cooling capabilities of those chips as they ran quite hot, however, Intel has designed a dedicated RL-ILM to fix the issue.

It is said that the integration of RL-ILM (Reduced Load) is optional for vendors, and it comes with improved thermal performance as well. It will reportedly cost