Intel & ARM Sign Deal To Manufacturer Next-Gen Mobile SOCs Using 18A Process Node

wccftech.com:

Intel & Arm signed a multigeneration agreement that would allow the manufacturing of next-gen mobile SOCs utilizing the 18A process node. The two companies plan to focus on the mobile sector but will expand "into automotive, Internet of Things (IoT), data centers, aerospace, and government applications."

Current and future Arm clients looking to create the next-generation mobile SoCs will find the added Intel 18A process technology to be a huge benefit to delivering next-gen transistor technologies for increased performance and power that Intel is known for along with the company's rich manufacturing footprint that expands through "U.S.- and EU-based capacity."

There is growing demand for computing power driven by the digitization of everything, but until now fabless customers have had limited options for designing around the most advanced mobile technology. Intel’s collaboration with Arm will expand the market opportunity for IFS and open up new options and approaches for any fabless company that wants to access best-in-class CPU IP and the power of an open system foundry with leading-edge process technology.

— Pat Gelsinger, CEO, Intel Corporation

This joint effort is part of Intel's IDM 2.0 strategy, allowing the company to invest in cutting-edge manufacturing capacity globally, especially in crucial U.S. and E.U. expansions "to serve sustained long-term demand for chips."

The new cooperation with Intel and Arm will allow the two companies to reach a "balanced global supply chain for foundry customers" seeking to work with mobile SoC projects based on Arm's CPU cores. Arm partners can access Intel's "open system foundry model," which allows clients to reach levels above "traditional wafer fabrication." This includes areas