AMD Believes That CPU Temperatures Will Continue To Increase With Future Higher Density Ryzen Chips
AMD seems to believe that given the advancements in chip densities, the overall CPU temperatures will continue to increase with future Ryzen generations.
The AMD Ryzen 7000 CPUs are single-handedly the most efficient chips available for client PCs. The Zen 4 core architecture which they pack delivers massive gains in single and multi-threaded performance which comes thanks to increased transistor density and various architectural changes. However, the increasing transistor density within a smaller footprint is also leading to a drastic rise in CPU temperatures.
The latest Ryzen 7000 CPUs codenamed Raphael run really hot at stock specs. They usually hit the peak Tjmax of 95C when running any CPU-intensive task and require a lot of cooling performance for overclocking. The CPUs can also be undervolted and retain almost similar performance while reducing temperatures by a bit though AMD expects that this trend is going to continue in future generations as chip density continues to increase.
In an interview with QuasarZone, AMD's VP, David Mcafee, states how they are working hard with TSMC to optimize the latest process technologies to deliver quality and stability of their chips but since modern CPU architectures are doubling or even going beyond that in terms of transistor count each generation and getting crammed within smaller die sizes, the heat output will either be the same as it is right now or continue to increase.
Q. One of the criticisms regarding AMD desktop products is CPU temperature. The CPU power consumption is clearly lower than that of competitors, but the temperature is higher. Will these temperature issues be resolved in the future? Wouldn't it be possible to induce heat dissipation by attaching a dummy die
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