The cutting-edge 3nm process developed by TSMC only had Apple as the sole customer, but with just a couple of days remaining for 2024 to start, the Taiwanese foundry is expected to secure more orders for the second iteration of its advanced node dubbed ‘N3E.’ This will allow the manufacturer to ramp up production, with the latest report stating that the company’s operational capacity is said to jump to 80 percent in the second half of 2024.
TSMC was currently fulfilling 3nm chip orders for Apple under its ‘N3B’ process, with various reports indicating that the iPhone maker’s competitors, such as Qualcomm and MediaTek, chose to launch their chipsets on the 4nm process thanks to the high wafer price. According to an earlier report, the tape-out costs alone for the M3, M3 Pro, and the M3 Max was $1 billion, so looking at this estimated expense, it is evident that only an entity such as Apple could bear this kind of expenditure.
However, the California-based giant’s technological edge may dwindle in 2024, with The Elec reporting that TSMC’s operational capacity in the second half of next year for the 3nm process is said to reach 80 percent. Both Qualcomm and MediaTek are said to launch the Snapdragon 8 Gen 4 and the Dimensity 9400, respectively, on this 3nm process, with Apple also aiming to launch the ‘A18’ for the iPhone 16 family, presumably on this next-generation technology, giving TSMC an influx of orders to enjoy a healthy revenue stream.
Apple also plans to expand its M3 line to the more affordable Mac options, so TSMC will attain much-needed motivation to increase its operational capacity. Still, the Taiwanese chip behemoth has enjoyed being Apple’s exclusive chip supplier, as M3 and A17 Pro orders reportedly allowed
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