TSMC Details Next-Gen Process Nodes, N3P & N2 to Bring Significant Performance Uplifts
TSMC held a conference in Japan where it provided developments on the N3E process node & the performance uplifts that it brings. Along with that, the company also provided a roadmap for its next-gen N2 process.
TSMC's SVP, Kevin Zhang, described the company's accelerated growth claiming that the investment amount in the fiscal year of 2022 reached 5.4 billion dollars. Moreover, the active personnel in the company also reached 8,558, showing that the company is rapidly expanding its facilities and investing time and money in next-gen processes.
Highlighting the evolution of previous processes, the company also presented performance uplifts for each derivative product of the 5nm process. Apart from the N5P, N4, and N4P processes, the company shared figures for the new N4X node, claiming a 17% performance improvement and 6% higher chip density than the N5 which was released three years ago.
Coming to 3nm, TSMC reiterated that mass production had been initiated since the beginning of 2022. However, the updated N3E process has achieved technical certification and will be commercially available by H2 2023. Moreover, the N3P process, one of the advanced versions in the 3nm family, will go into production by 2024, bringing 5% better performance, 5-10% lower power consumption, and 1.04x higher chip density than the N3E.
Due to the automotive industry's rapid demand, TSMC also plans to introduce an N3AE node, which is based on the N3 process but modified for applications such as autonomous driving. It will be initially provided as PDK kits to companies to test and achieve support for the new process.
Finally, the company mentions its much anticipated 2nm process, which is underway and set for production by 2025. TSMC will switch to
Read more on wccftech.com
