Lenovo Legion Go Handheld Teardown Reveals Smaller Cooling Solution, Ryzen Z1 Extreme APU
Lenovo's Legion Go handheld console has finally received a teardown, revealing the internals of the second AMD Ryzen Z1-powered device.
The teardown video has been shared on the Chinese social media platform Bilibili, by the famous hardware leaker Golden Pig Upgrade. Starting with the internals, the overall configuration is quite similar to what we have seen with other mainstream handhelds in the market, however, the noticeable difference is the more compact cooling solution, and when compared to its nearest competitor like ASUS's ROG Ally, the difference is quite evident.
The first difference is that the Lenovo Legion Go handheld comes with just one fan to dissipate heat out of the chassis whereas the ASUS ROG Ally comes with two fans. The heatsink solution makes use of an aluminum fin design with a single copper heatpipe whereas the ASUS ROG Ally comes with two copper heat pipes and a copper baseplate.
ASUS had some issues with the heat output of its ROG Ally during launch which it had to fix via firmware updates but early tests have revealed that the Lenovo Legion Go mostly offers the same temperatures as the ROG Ally at the same TDP in gaming.
Moreover, upon further digging, the user then detached the ABS plastic mounting bracket to unveil the gigantic 49.2 Wh battery, which has taken up a major chunk of space of the device's total size. After revealing the battery compartment, the expert then went into the more exciting part, which is the Lenovo Legion Go's main PCB, which constitutes most of the "goodies".
This particular unit of Legion Go features AMD's Z1 Extreme APU along with 16 GB LPDDR5X-7200 memory, boasting high speeds. For storage purposes, you get up to 1TB PCIe Gen4 SSD and a micro-SD slot supporting up to
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