Huawei Files A Patent That Enhances Wafer Alignment And Efficiency, Hinting At The Company’s Self-Built Fabrication Plants

wccftech.com:

Huawei has remained mum on the subject of building its own fabrication plants, and that is likely to avoid further trade restrictions from the U.S. However, a recent patent filing provides evidence that the former Chinese giant is going the extra mile to reduce dependency on foreign companies. The patent application date is June 2022, describing a process for improving wafer alignment and efficiency. It is titled ‘Wafer Processing Device and Wafer Processing Method’ and provides some evidence that Huawei wishes to build its chip plants, which can mean it may want to rid itself of SMIC too.

Huawei has been reported to be involved in building its own fabrication plants, with the company said to be actively participating in expanding three sites in the country. Huawei is said to have acquired manufacturing facilities from Jinhua Integrated Circuit (JHICC) and Qingdao Aristocrat (Suppoly). The firm has also aided in establishing production facilities operated by Pengxinwei (PXW) and Shenzhen Pengsheng Technology (PST), both of which are currently experiencing difficulties in acquiring advanced wafer manufacturing equipment due to U.S. trade sanctions.

TrendForce reports that the patent could mean that Huawei is proceeding to a stage where it will be self-sufficient, but it has not mentioned how will the company’s relationship with SMIC be maintained. The following talks about the wafer patent and how the process improves alignment and efficiency:

“The patent abstract shows the embodiments disclosure related to devices and methods for wafer processing. The wafer processing device comprises a wafer stage rotated along a rotation axis, a mechanical arm with a robotic hand for handling wafers and placing them on the wafer stage, a