Exynos W1000 Is Samsung’s First 3nm GAA Chipset, New CPU Cluster Boasts Up To A 370 Percent Performance Bump, Features Advanced Packaging & More
Samsung is reportedly struggling with improving its 3nm GAA yields, which would ultimately be the reason for the Exynos 2500’s delay. However, this obstacle has not prevented the company from officially announcing the Exynos W1000, its first SoC fabricated on its cutting-edge architecture that delivers incredible power efficiency while obtaining significantly higher single-core and multi-core performance. Here are more details that you would love to check out.
New ‘1 + 4’ CPU cluster helps the Exynos W1000 achieve high single-core and multi-core performance compared to previous-generation SoC
Apart from the obvious benefits that come with the 3nm GAA process, Samsung has designed an improved CPU cluster for the Exynos W1000. There are a total of five cores, with one Cortex-A78 performance core running at 1.60GHz and four Cortex-A55 efficiency cores running at 1.50GHz. Samsung claims that the single-core performance of the Exynos W1000 can reach up to 340 percent compared to the previous generation and a 370 percent performance gain in multi-core capabilities.
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The inclusion of this CPU cluster means that key applications can launch up to 270 percent faster, with users effortlessly switching between programs seamlessly thanks to the performance gains. The Exynos W1000 also supports various packaging technologies, such as fan-out panel-level packaging (FOPLP) and embedded packaging on package (ePOP). These two additions allow the Exynos W1000 to achieve a small form factor while enhancing heat dissipation and obtaining a thin and compact package.
The new SoC also supports a display with a 960 x 540 resolution and an LTE Cat.4 modem with a 150Mbps download speed and up to 75Mbps upload speed. For storage, the Exynos W1000 supports up to 32GB of eMMC onboard memory, making it slower than UFS or NVMe, but it
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