AMD is working on some cool new features for its next-gen Ryzen 9000X3D "3D V-Cache" family, powered by the new Zen 5 core architecture.
Well, at this year's Computex, AMD didn't have much when it came to the combination of Zen 5 and 3D V-Cache, which is to be expected since the X3D SKUs come out a bit later after the standard "X" chips. However, PC Gamer had managed to chat with AMD's senior technical marketing manager, Donny Woligroski, where he revealed that the firm is indeed working on future "X3D" processors. Here is what he had to say:
While Donny didn't elaborate on what those "cool differentiators" actually were, it might be that the firm would be working upon a "varied" 3D V-Cache" configuration for its Ryzen 9000X3D CPU lineup, which means that different CPU models would be equipped with different sizes of 3D V-Cache to segregate the lineup even further. Another assumption would be that AMD might try to integrate 3D V-Cache with its APU models, but that isn't certain for now since it would create more die complexities.
Currently, AMD offers a single-stacked cache across all of its X3D CPUs, whether those be Ryzen 5000X3D or Ryzen 7000X3D SKUs. The company has 6-8 core 3D V-Cache variations within the Ryzen 5000 family and 8-12-16 core variations within its Ryzen 7000 family. The company has also teased engineering samples featuring dual 3D V-Cache stacks but those didn't make it to release due to higher cost, power, and thermal characteristics. With Zen 5, we may see AMD venture more into the 3D V-Cache realm with diverse offerings as mentioned above.
For now, we can expect developments on future Ryzen 9000X3D "3D V-Cache" models after the release of the next-gen Ryzen 9000 series, which is set to debut
Read more on wccftech.com