NVIDIA's Blackwell GB202 GPU for the GeForce RTX 5090 Flagship will see a hefty die size increase versus the existing Ada flagship.
The NVIDIA GeForce RTX 5090 graphics card will be the flagship solution within the GeForce RTX 50 "Blackwell" gaming lineup. This chip is expected to bring in some huge gains over the RTX 4090, but it looks like the chip will also be gargantuan in terms of die size while making use of TSMC's 5nm process node.
According to MEGAsizeGPU, the NVIDIA GB202 GPU which will be featured on the RTX 5090 will be roughly 24x31mm in terms of die size, which totals to 744 mm2. The GPU will feature a package size of 63x65mm which is roughly 3528mm2. For reference, the RTX 4090's AD102 GPU featured a die size of 609mm2 and a package size of 2601mm2 (51x51mm). This is a 22% increase in the die size and a 35% increase in the packaging area.
Now a bigger die size doesn't mean that the chip will eventually be more power-hungry or run hot, but it should be remembered that it is still a smaller die size than the 754mm2 Turing TU102 chip which was launched with the first generation RTX "20" cards. The chip included Tensor and RT core technology for the first time on an NVIDIA GeForce "Gaming" GPU and since then, we have seen a reduction in die size for flagship chips for each consecutive process node optimization.
Starting with the details, we first have the NVIDIA GeForce RTX 5090, which is going to be the top GPU in the lineup. The graphics card is expected to feature the PG144/145-SKU30 PCB design & that's going to incorporate the GB202-300-A1 GPU core. The GPU will have 170 SMs enabled out of the total 192 SMs and will feature 21760 cores instead of the total of 24,576 cores. This marks an 11.4% reduction,
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