MediaTek And TSMC Successfully Develop First 3nm Mobile Chipset, With Up To 32 Percent Power-Efficiency, Volume Production Starting In 2024

wccftech.com:

MediaTek decided to skip its upcoming Dimensity 9300 launch casually and, through a joint press release with TSMC, officially announced that both companies have developed the world’s first 3nm chipset. The announcement comes less than a week after Apple is set to unveil its own 3nm SoC, the A17 Bionic, but sadly, MediaTek’s cutting-edge silicon will not be available this early because, according to the details, it will enter volume production in 2024.

To nearly no one’s surprise, MediaTek and TSMC did not divulge the name of the 3nm chipset, but Dr. Cliff Hou, who is the Senior Vice President of Europe and Asia Sales at TSMC, states below that both companies will continue their work on next-generation manufacturing processes, hinting at better chipsets.

“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket. Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“

Perhaps the biggest strength of TSMC’s 3nm process is its power efficiency. Though MediaTek notes in its press release that compared to the Taiwanese manufacturer’s N5 node, the next-generation one can deliver an 18 percent performance gain at the same power level, the biggest gains are in the power savings. The new technology can consume 32 percent less power at the same speeds, along with a 60 percent increase in logic density. Sadly, despite being the first to come out with a press release, we will not see this unnamed SoC release this year.

For one thing, the Dimensity 9300