Loongson's next-gen CPUs such as the 3B6600 will be able to match Intel's 12th & even 13th Gen chips, according to the company's Founder.
In an interview with CENA (China Electronics), Loongson's Founder & Chairman, Hu Weiwu, talked about the company's upcoming consumer product for China's domestic market. The latest follow-up to the 3A6000 will come early next year in the form of 3B6600 which is going to feature some big performance uplifts.
Starting with the 3A6000, Loongson showcased some strong performance which showed better IPC than Intel's 10th Gen & AMD's Zen 2 parts. The CPU even managed to reach Core i5-14600K perf in a clock-to-clock test when it was overclocked to 3 GHz. Knowing that it has got a potent chip on its hands, Loongson is accelerating the development of its next-generation CPUs and the 3B6600 CPU will serve as the first of the many on its roadmap.
In terms of specifications, the Loongson 3B6600 CPUs will feature the LA864 architecture which will be based on a localized process node, probably SIMC. The chip will feature 8 cores using a hybrid BIG.little design in a 4+4 configuration and feature a clock speed of 3.0 GHz. The BIG cores are said to improve performance beyond 20% which is mainly achieved through structural optimizations. In addition to the CPU cores, the chip will also incorporate the LG200 integrated GPU which will allow for more decent graphics capabilities without requiring a discrete GPU.
Weiwu states that he's very confident in the next-generation 3B6600 products and the CPU will be easily matching Intel's 12th & 13th Gen CPUs (mid-to-high-end stack). In addition to performance, Loongson will further streamline Windows OS and application support on its Linux platform.
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