Intel is rumored to be integrating Panther Lake's memory controller & compute die into a single package to address the latency issues in current architectures.
Well, it looks like Team Blue isn't satisfied with existing tile configurations and is probably looking to switch things up with the release of its next-gen mobile SoCs, with a major change expected to occur with the IMC (Integrated Memory Controller) and the Compute die.
The renowned leakers kopite7kimi and Jaykihn have disclosed that Intel plans on putting the IMC and compute die into a single package in an attempt to fix performance and efficiency issues encountered with lineups such as the Arrow Lake, and it is said to be more of a "hit and trial" move.
With Intel's Arrow Lake, the IMC and Compute die are presented as two separate entities, and with the IMC being an off-die solution, data transfer has become much more inefficient now. It had to travel across dies to reach the memory controller from the Compute die, indeed creating higher latencies, which were prominent with Arrow Lake. With Intel potentially combining the IMC onto the Compute Die, we will witness reduced latency, given that data wouldn't need to travel across die-to-die, and instead, it will be an instantaneous process.
Given that the IMC moves to the Compute Die, along with other sub-systems, Intel might exclude the SoC tile with Panther Lake due to its scale, since through this, not only can the company reduce design complexities and enhance scalability but achieve desired performance targets as well, which is why this move hasn't been made with existing
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