AMD Strix Halo APU Details Leak: Twice As Big As Strix Point, Powerful RDNA 3.5 iGPU, Up To 120W TDP, Coming To ASUS ROG Flow Z13 In 2025
AMD's Strix Halo APUs for enthusiast mobile platforms have been further detailed in a new leak which points out some interesting aspects of the chip.
AMD Strix Halo APU Leak Reveals Huge RDNA 3.5 iGPU, LPDDR5x-8533 Memory Support, Up To 120W TDPs
The latest details come from multiple blog posts by thermal engineer and specialist, Sam Jiun-Wei Hu, who has worked on developing a new cooling solution for the ASUS ROG Flow Z13 (2025) PC tablet. This semi-tablet and semi-laptop design will be a powerful device with lots of performance thanks to the AMD Strix Halo APUs incorporated within it.
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So let's start with the AMD Strix Halo die. Actual measurements of the Strix Halo package and each of the dies are provided. The entire chip is made of up three chiplets which include two Zen 5 CCDs and a singular GPU die featuring the I/O and memory controllers. The Zen 5 CCDs measure 66.345 mm2 and 70.6 mm2 if you include the die stiffeners. The CPU packages feature 8 cores per CCD for up to 16 cores and 32 threads based on the Zen 5 architecture. We also recently covered an 8-core Strix Halo configuration with up to 5.36 GHz clocks.
The iGPU die, measures 19.18 x 16.02mm or 307 mm2 which is larger than the whole Strix Point APU which measures 232.5 mm2. This is as big as a discrete GPU and we know why. The iGPU would be packing up to 40 RDNA 3.5 compute units which should offer some hefty performance.
For the whole Strix Halo die, the dimensions are 24.04mm x 19.78mm which equals 475.31 mm2, making it almost twice as large as the Strix Point APU. The bigger die is listed as the IOD and it is listed with a hotspot temperature of 86.6C which means that it won't be the Zen 5 CCDs but the RDNA 3.5 iGPU which will be the most power-hungry and thermal-intensive die on this chip.
- Strix Halo CPU Die (Zen 5 CCD): 9.055mm x 7.327mm = 66.345mm2
- Strix Halo IOD Die (RDNA 3.5 iGPU +
