Xiaomi’s Upcoming In-House 3nm Chipset Will Reportedly Be Paired With An Unreleased MediaTek 5G Modem To Deliver Top-Notch Speeds

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History could be made next year as Xiaomi is reported to be gearing up to launch a custom silicon next year, but the impressive aspect about this endeavor is that it is said to use the 3nm process. While there is no mention of which foundry partner the Chinese firm is said to have partnered with to turn this dream into a reality, one of the challenges aside from the potential trade sanctions enforced by the U.S. is which 5G modem will be paired with this SoC. We have discussed Xiaomi’s potential partners in a past report, but according to the latest update, the company will team up with MediaTek here.

MediaTek’s T90 5G modem is said to be used in Xiaomi’s unnamed 3nm chipset, and it could be a newer iteration to deliver incredible speeds and efficiency

The latest information was published on Weibo by a user with the handle that machine-translates to ‘Mobile phone chip expert.’ His past predictions reveal that he is close to the semiconductor industry, so it is possible that one of his sources informed him that the custom 3nm Xiaomi chipset will feature a MediaTek T90 5G modem. When we browsed the standalone products offered by MediaTek on its official website, the latest baseband solution on the list was the T830, and that too for different applications.

Related Story Xiaomi’s In-House 3nm Chipset Will Not Have An Integrated 5G Modem And Will Have To Be Sourced From Overseas Suppliers, Which Comes With Some Risk

We have attempted to search for the T90, ranging from its user manual to any specifications data, but with no luck, which suggests that Xiaomi’s in-house 3nm chipset will be paired with an unreleased MediaTek solution. The Chinese company might want to amplify the SoC’s wireless capabilities and compete with Qualcomm’s Snapdragon X80 5G modem. MediaTek has successfully caught up with industry leaders like Apple, releasing its Dimensity 9400, which is the company’s first to be mass produced on TSMC’s second-generation 3nm process.

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