For the past three years, we have been greeted with the Pixel design that always somehow manages to light a smile on our faces, with the exterior shell being a breath of fresh air. Unfortunately, that air turns rancid in a snap as the pleasing aesthetics of Google’s flagship or mid-ranged smartphone family are not aligned with the company’s silicon vision. With the Tensor G3 being yet another disappointment compared to the competition, will we finally see the Tensor G4 turn over a new leaf when powering the Pixel 9 and Pixel 9 Pro? Our rumor roundup discusses the upcoming SoC’s specifications, potential features, and everything else you might want to learn, so let us get started.
Samsung has not garnered the best of reputations when compared to TSMC, but given that Google does not accumulate the same number of smartphone shipments as companies like Apple, it will stick to a foundry that can provide it with the best pricing, irrespective if it ends up delivering an inferior product. With the Tensor G4, we expect Google to take advantage of Samsung’s 4nm LPP+, the same node used to mass produce the Exynos 2400 that is found in some Galaxy S24 and Galaxy S24 Plus models. Historically, Google’s earlier Tensor releases have been based on Samsung’s Exynos chipsets, with the Tensor G3 sporting the same 9-core CPU cluster as the unreleased Exynos 2300.
This revelation would suggest that the Tensor G4 can be based on the Exynos 2400. That will not just mean that Samsung’s more efficient 4nm LPP+ would be leveraged, but Google might employ the Korean giant’s ‘Fan-out Wafer Level Packaging’ (FOWLP), which helps increase heat resistance, leading to better thermals and as a result, increased multi-core performance. After the Tensor G3’s abysmal showing in controlling its temperatures in the 3DMark Wild Life stress test, this technology could be
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