Next-Gen AMD 700-Series “AM5” & Intel 800-Series “LGA 1851” Socket Motherboards Aiming Q3 2024 Launch
AMD & Intel motherboard partners are aiming for a Q3 2024 launch for the next-gen 700-series "AM5" & 800-series "LGA 1851" platforms.
Chinese board channel forums who have cited various motherboard partners & industry sources, report that the next major motherboard upgrade cycle will occur in Q3 2024 which is about a year away from now. Both AMD and Intel are said to introduce their latest chipsets which motherboard makers will utilize in next-gen products but AMD will be flexible based on the choices Intel makes since they aren't in a hurry which we will tell you why.
Starting with Intel, the company has its LGA 1700 socket which is featured on two generations of motherboards, the 600-series (Z690, H670, B660, H610) & the 700-series (Z790, B760, H710). The motherboards feature support for three generations of CPUs, the 12th Gen Alder Lake, 13th Gen Raptor Lake, and the recently launched 14th Gen Raptor Lake Refresh CPUs. Motherboard makers also slightly refreshed their Z790 lineup with new boards featuring the latest I/O capabilities such as WIFI7 and BT5.3.
However, Intel plans to make a major shift to a brand-new platform in 2024. The next-gen 800-series boards will utilize the LGA 1851 socket which will debut with the launch of Arrow Lake-S Desktop CPUs in 2H 2024. The 800-series family will include Z890, H860, and H810 motherboard products while also getting W880/Q870 chipsets for workstations and business products.
Based on previous information, the Intel Z890 platform is expected to feature up to 60 HSIO channels (26 CPU + 34 PCH while the B860 and H810 platforms will feature 44 and 32 HSIO channels, respectively. Intel's 800-series platform will also support up to DDR5-6400 memory natively and with 48 GB memory
Read more on wccftech.com
