The Taiwanese semiconductor manufacturer, MediaTek, has announced its first chipset with mmWave support will be coming to the U.S. later in 2022. MediaTek's Dimensity 5G chips are used by several brands, but despite their popularity, they have never had support for mmWave 5G, which some U.S. and Japanese carriers use.
While most recent smartphones launched in the U.S. have 5G, not all work with the existing 5G technologies. In some cases, the buyer has to do due diligence to determine which model works with the 5G network available in their area of residence. Sometimes, models that support certain 5G technologies are only available via a specific carrier, so those who need such phones have to purchase them through such companies.
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The new MediaTek chipset is the Dimensity 1050 and it has support for both mmWave and sub-6GHz 5G technologies, a first for a MediaTek chipset. By supporting both 5G technologies using 3CC carrier aggregation, MediaTek said it would be able to deliver «up to 53 percent faster speeds» compared to LTE + mmWave aggregation. Built on TSMC's 6nm node, the chipset has eight CPU cores. In addition to supporting both 5G technologies, the chip also has support for True Dual 5G SIM and Wi-Fi 6E (2x2 MIMO).
For its CPU, the Dimensity 1050 has two Cortex-A78 cores clocked at 2.5GHz and six Cortex-A55 cores clocked at 2.0GHz. The CPU is paired with an Arm Mali-G610 MC3 GPU for graphics and a MediaTek APU 550 for handling artificial intelligence tasks. It also has MediaTek's HyperEngine 5.0, the same game engine inside the more powerful Dimensity 1300 processor. The game engine features AI-driven Variable Rate Shading (AI-VRS),
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