Intel provided a small update regarding its next-gen Arc GPUs and the packaging designs of its next-gen Panther Lake & Nova Lake CPUs.
Intel's CEO Pat Gelsinger announced plans for the company after disclosing Intel's Q3 2024 earnings. From mobile chips to discrete GPUs, Pat shared the company's roadmap that aims at improving the portfolio and the company's revenue, which currently isn't in a good state following the recent CPU launches.
The chip giant is moving on to a different package design for the mobile platform for future lineups. If you are aware of the Lunar Lake package, you must already have known that the Lunar Lake chips bring memory onboard. This is why the SKUs were present with either a 16 GB or 32 GB memory configuration for the laptops.
Lunar Lake processors feature a complex integration of LPDDR5X memory and, as per Intel, this isn't usually the right way to do it. According to the CEO, this is "not a good way to run the business" but fortunately, for the company, Lunar Lake was a niche and a one-off product that Intel still managed to sell like hotcakes but isn't ready to continue for the following generations. Pat said,
The company is set to bring the traditional design for the Panther Lake (set to launch in the second half of 2025) and the Nova Lake series, which will focus more on the CPU, GPU, NPU, and I/O dies. The on-package memory will be completely ditched on these lineups as well as the lineups succeeding Nova Lake. Lunar Lake was a niche, designed for high performance and great battery life, but with the AI PC, it demanded a high-volume product.
Furthermore, Intel will aim to build its products by reducing outsourcing, and about 70% of the Panther Lake CPU die is going to use wafers from Intel's
Read more on wccftech.com