Exynos 2400 Progress Detailed In Latest Rumor, Called The ‘Most Advanced Mobile Chip,’ But There Are A Few Downgrades

wccftech.com:

The Exynos 2400 rumors are back on the table, with a few bits of information talking about the packaging method of Samsung’s upcoming flagship SoC. One tipster mentions that in terms of hardware, it will be the most advanced mobile chip, but also talks about some areas where Samsung is rumored to take shortcuts with its design so that right there is a contradictory statement.

The latest update from RGcloudS, who had taken a break from Twitter for a while, states that the Exynos 2400’s final specifications and packaging method are still in negotiation between Samsung’s various divisions. However, according to what he has heard, the upcoming SoC is said to be downgraded to ‘I-Cube’ technology. In case you are unfamiliar with this term, the Korean giant has provided some details regarding this integration technology, stating that one or more dies are placed horizontally.

“Samsung’s I-Cube is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.”

1/4Exynos 2400 on progress

final spec, packaging method, etc still in negotiation between division

samsung 2.5D & 3D packaging method finally mature for all designs, thanks to synopsys

first exynos with 2.5D I-CubeS https://t.co/y1nG40pn6I

— RGcloudS (@RGcloudS) July 12, 2023

However, there was a rumor doing the rounds that the Exynos 2400 would be mass produced on the Fo-WLP, or Fan-out wafer-level packaging method, which improves power efficiency while reducing the thickness of the chip. It appears that for cost-saving purposes, Samsung may switch to the I-Cube integration process, but it remains to be