MediaTek's newest chipset is the Dimensity 1300, a system-on-chip designed for and expected to appear in mid-range smartphones in 2022, but how does it fare against the competition? MediaTek's line of mobile phone processors can be classified into two groups — Dimensity and Helio. Dimensity is the semiconductor company's line of 5G smartphone platforms which means any chipset with a Dimensity prefix has a 5G modem.
Alternatively, chipsets with Helio in their names have a 4G modem. The Dimensity line is further divided into five sub-groups. At the top is the flagship family with the Dimensity 9000 processor, followed by the premium family with the Dimensity 8000 and 8100 processors. Also available are Dimensity 1000, Dimensity 900, Dimensity 800 and Dimensity 700 family groups.
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The Dimensity 1300 is the latest member of the Dimensity 1000 family, and it takes over leadership from the Dimensity 1200. The 6nm chipset was built by TSMC on its N6 (6nm-class) production process and has eight CPU cores in a 1+3+4 arrangement. The prime core is a Cortex-A78 with a 3GHz clock speed, and it is paired with three performance cores that are also Cortex-A78 ones but with a 2.6GHz clock speed. The remaining four are Cortex-A55 cores clocked at 2.0GHz. In addition, MediaTek has added a Mali-G77 GPU with nine cores and a six-core APU to handle artificial intelligence tasks. Other features are Bluetooth 5.2, Wi-Fi 6, support for genuine dual 5G SIM, support for up to 168Hz refresh rate, and support for cameras up to 200MP.
Technical specifications for the Dimensity 1300 are identical to those of Dimensity 1200. However, it isn't a rebadged chip. Instead, MediaTek's
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