Android smartphone makers have typically relied on Qualcomm and MediaTek for their ‘off the shelf’ chipsets, with the Snapdragon 8 Elite and Dimensity 9400 said to be included in the majority of high-end releases this year and the next.
Xiaomi, for the most part, will also rely on the two aforementioned companies, but it is likely starting to realize that it will only get more expensive for it to maintain dependency on these partners going forward, with the only way to improve profitability is to jumpstart its custom chipset endeavors.
According to the latest report, Xiaomi is said to officially launch its 3nm silicon next year, which should make the competition pretty nervous.
No concrete launch timeline has been provided, and based on the current situation, Xiaomi will likely leverage one of TSMC’s 3nm variants for its custom chipset We previously reported in October that Xiaomi had completed the tape-out of its first 3nm chipset, meaning that the only step remaining was to find a foundry partner to put the design into mass production.
However, there was no word on when the company would officially launch the in-house silicon, but according to DigiTimes, the unveiling will happen sometime next year.