ASUS' ROG Phone 6D Ultimate has an even more elaborate cooling system

engadget.com:

After the launch of the ROG Phone 6 Pro gaming phone, some hardcore fans were left wondering what happened to the "Ultimate" variant. As it turns out, ASUS waited for over two months before unveiling its "one more thing": the ROG Phone 6D Ultimate. It's identical to the 6 Pro in almost every way, except for four things: the new "space gray" color, the interesting choice of the MediaTek Dimensity 9000+ processor (which is what the "D" in "6D" stands for), the switch to the faster LPDDR5X RAM, and the new "AeroActive Portal" design for blowing cool air into its internal heat-dissipation fins — I'll abbreviate this as heatsink from here onwards.

The AeroActive Portal itself is essentially a door flap that opens when the bundled AeroActive Cooler 6 is attached, so that a portion of the cool wind produced by the fan — at nearly 1,000cc per second — is guided through a wind tunnel and into the heatsink, with hot air coming out from the top slot. The heatsink is, of course, linked to the generously sized thermal layers covering the logic board and battery cells, in order to transfer heat from the components to the airflow. This is to help sustain a high frame rate over a longer period while gaming, as well as to ensure the phone is still comfortable to hold.

ASUS claimed that after 60 minutes of Perfdog benchmarking on Genshin Impact at 60Hz in air cooling mode, the ROG Phone 6D reached 36.9°C (98.42°F), which was 3.4°C lower than the ROG Phone 6 in the same mode. It appears that the AeroActive Portal does make a notable difference. Likewise in "Frosty" and "Frozen" modes (with the Peltier thermoelectric cooling chip enabled), and it's worth noting that the AeroActive Cooler 6 is the only Peltier-enabled cooler in the market that